- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
An expanded metallization area on the surface of a die where the bonding wire will be placed.
Industry:Semiconductors
Any coating thickness less than 5µ (5 X 104 A), typically formed by vacuum depositing or sputtering.
Industry:Semiconductors
An extra bond attached to the edge of the post or land area of a package (but never to the bonding pad on the die) for the purpose of clearing the bonding machine.
Industry:Semiconductors
The voltage level at which a device will recognize a falling or rising voltage as a change in logic state.
Industry:Semiconductors
Pulling of the bond wires to destruction to determine the strength of the bonds.
Industry:Semiconductors
A mounting technique for semiconductor packages in which the device leads are passed through holes in the mounting surface. Attachment of leads may be accomplished with solder or with other mechanical means.
Industry:Semiconductors
A flat pack with the leads brazed to feedthroughs on the bottom of the package rather than passing through the package side.
Industry:Semiconductors
A term commonly misapplied to the solder dipping of device leads (see solder dip).
Industry:Semiconductors
Subcircuitry designed into a circuit to allow that circuit to test itself either at a predetermined interval or upon external command.
Industry:Semiconductors
Accumulated radiation due to prolonged exposure to a radiation field (as encountered, for example, by satellites in the earth's Van Allen belt).
Industry:Semiconductors
